[1]周翠,白绘宇,刘晓亚.晶须与偶联剂改性大豆蛋白胶黏剂[J].大豆科学,2009,28(01):130-135.[doi:10.11861/j.issn.1000-9841.2009.01.0130]
　ZHOU Cui,BAI Hui-yu,Liu Xiao-ya.Modified SPI Adhesives with Whiskers and Silane Coupling Agent[J].Soybean Science,2009,28(01):130-135.[doi:10.11861/j.issn.1000-9841.2009.01.0130]
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晶须与偶联剂改性大豆蛋白胶黏剂

《大豆科学》[ISSN:1000-9841/CN:23-1227/S] 卷: 第28卷 期数: 2009年01期 页码: 130-135 栏目: 出版日期: 2009-02-25
Title:
Modified SPI Adhesives with Whiskers and Silane Coupling Agent
文章编号:
1000-9841(2009)01-0130-06
作者:
周翠; 白绘宇; 刘晓亚
江南大学化学与材料工程学院，江苏 无锡 214122
Author(s):
ZHOU Cui; BAI Hui-yu; Liu Xiao-ya
School of Chemical and Material Engineering，Jiangnan University，Wuxi 214122，Jiangsu,China
关键词:
大豆分离蛋白SPI; 硅烷偶联剂KH560; 碳酸钙晶须; 剪切强度; 耐水性
Keywords:
Soy protein isolate; Silane coupling agent KH560; CaCO 3whiskers; Shear strength; Water resistance
分类号:
TQ645.9
DOI:
10.11861/j.issn.1000-9841.2009.01.0130
文献标志码:
A
摘要:
选用硅烷偶联剂KH560作为改性剂，对碳酸钙晶须进行表面改性。研究了经KH560改性的碳酸钙晶须对大豆分离蛋白(SPI)胶黏剂粘接性能和耐水性的影响，考察了KH560用量和碳酸钙晶须用量对胶黏体系性能的影响。利用万能试验机测试对胶黏剂体系的剪切强度进行了测试，借助差示扫描量热仪（DSC）对胶黏剂热性能进行了分析。结果表明：当KH560用量为4%（wt）、碳酸钙晶须用量为2%（wt）、SPI含量为10%（wt）时体系的粘接性能和耐水性最好，与未改性SPI胶黏剂相比，干剪切强度提高了28.88%，浸泡后剪切强度提高了71.41%，湿剪切强度提高了76.68%；变性温度与未改性SPI胶黏剂相比有所下降。此外，利用FTIR和光学显微镜对体系内部结构进行了表征。
Abstract:
With the shortage of oil resources and worsening environmental pollutions，the development of environment friendly materials has become the focus of research recently.Soy protein has attracted considerable attention for its adhesive potential，but the disadvantages of soy protein adhesives are relatively low shear strength and water resistance.The objective of this study was to imporove on shear strength and water resistance of soy protein by introducing whiskers and silane coupling agent.Soy protein was modified with modifier KH560 and whiskers.Effects of KH560 and whiskers on shear strength and water resistance of SPI adhesives were studied.It was observed that when content of KH560 was 4%，whiskers 2% and SPI 10%，dry shear strength improved by 28.77%，soaked shear strength by 71.41% and wet shear strength by 76.68%，respectively，compared to pure SPI.The thermal properties of pure SPI and SPI/KH560/whisker composites were characterized with differential scanning calorimeter(DSC)，and their structures were characterized with FTIR and optical microscope.

参考文献/References:

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备注/Memo

基金项目：国家自然科学基金资助项目 (NSFC50673038)。

作者简介：周翠（1985-），女，硕士研究生，研究方向为天然高分子改性。E-mail：zhoucuidl666@163.com。

更新日期/Last Update: 2014-10-03